Automation of Electroplating Technique Using P.L.C.

Authors

  • Urvashi Trivedi Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author
  • Patel Tanvi Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author
  • Ragde Arti Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author
  • Shah Hitesh Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author
  • Limbachiya Vandana Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author
  • Hinal Surati ,Electrical Department,UKA Tarsadia University/ C.G.P.I.T/ Maliba Campus, bardoli, India. Author

Keywords:

PLC, DC power supply, cation, electro-deposition

Abstract

Electroplating technique is widely utilized  

in various industries for the purpose of coating metal  

objects with a thin layer of a different metal’s. The  

layer of metal deposited has some desired property,  

which the metal of the object lacks. For example,  

chromium plating is done on many objects such as car  

parts, bath taps, kitchen gas burners, wheel rims and  

many others for the fact that chromium is very  

corrosion resistant, and thus prolongs the life of the  

parts. It is also used in making inexpensive jewelry.  

Electroplating increases life of metal and prevents  

corrosion. This paper deals with the detailed process of  

electroplating technique using PLC

Downloads

Download data is not yet available.

References

Baudrand (1994), Electro less nickel plating, surface engineering (Vol. 5). ASM Hand Book, Material Park, Ohio; American Society for Materials.

Van Nostrand Reinhold , Electroplating Engineering Handbook 4th Edition 1984, L.J Durney (Eds)

M.P. Groover,1986 Automation, Production Systems, and Computer-Integrated Manufacturing 3rd Ed, Prentice-Hall International

G.Coulouris and J Dillimore,1992 Distributed Systems - Concepts and Design, Addison-Wesley.

S. L. Wang, R. Tang, J. Zhou, H. Zhou, 2011 "Research on Automatic Electroplating Product Line’s Scheduling System in Small Batch and Multi Types of Electroplating", Advanced Materials Research, Vols. 317-319, pp. 621-626.

Ken Osborne, 1996 Metal Protection Ltd, Auckland, with editing by John Packer

B. Boudot and G. Nury, February 7, 1984 "Additive Composition Bath and Process for Acid Copper Electroplating," U.S. Patent 4,430,173.

W. H. Safranek, 1996.The Properties of Electrodeposited Metals and Alloys, 2nd Ed., American Electroplaters and Surface Finishers Society, Orlando, FL.

R. Bernards, G. Fisher, W. Sonnenberg, and E. J. Cerwonka, September 24, 1991 "Additive for Acid-Copper Electroplating Baths to Increase Throwing Power," U.S. Patent 5,051,154.

J. O. Dukovic,(1993) "Feature-Scale Simulation of Resist Patterned Electroplating,"IBM J. Res. Develop. 37, 125-141. [11] https://en.wikipedia.org/wiki/Electroplating.

Guiyan Li,Design and study of electroplating driving control system based on PLC ,Weifang University of Science and Technology, Shouguang, Weifang, Shandong, 262700, China.

Downloads

Published

2024-03-04

How to Cite

Automation of Electroplating Technique Using P.L.C. (2024). International Journal of Innovative Research in Computer Science & Technology, 5(2), 257–260. Retrieved from https://acspublisher.com/journals/index.php/ijircst/article/view/13500