Investigation of Impact of Temperature on Proposed Device with Reference to DIEL CYCLE . International Journal of Innovative Research in Computer Science & Technology, [S. l.], v. 11, n. 1, p. 32–35, 2023. DOI: 10.55524/ijircst.2023.11.1.7. Disponível em: https://acspublisher.com/journals/index.php/ijircst/article/view/10291. Acesso em: 24 nov. 2024.